Title :
Study of EMC for Cu bonding wire application
Author :
Seki, Hidetoshi ; Ping, Chen ; Nakatake, Hiroshi ; Zenbutsu, Shin-ichi ; Itoh, Shingo
Author_Institution :
Electron. Device Mater. Res. Lab. I, Sumitomo Bakelite Co., Ltd., Utsunomiya, Japan
Abstract :
The influence of EMC (Epoxy Molding Compound) and reliability with fine Cu wire was studied. It is found that the failure mode was corrosion at the intermetallic layer of the wire bonding part by failure analysis after HAST (Highly Accelerated Temperature & Humidity Stress Test). Al elution and Cl ion was observed at the intermetallic layer. EMC with lower Cl ion content and Al inhibitor of corrosion shows better HAST property. The selection of flame retardant for green EMC is important because some retardant has a negative impact on HAST performance.
Keywords :
aluminium; chlorine; copper; corrosion; failure analysis; lead bonding; life testing; moulding; Al; Cl; Cu; HAST; corrosion; epoxy molding compound; failure analysis; failure mode; flame retardant selection; green EMC; highly accelerated temperature test; humidity stress test; intermetallic layer; reliability; wire bonding; Bonding; Copper; Corrosion; Electromagnetic compatibility; Gold; Wire;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5679680
