Title :
Development of novel architecture and assembly techniques for a detector unit for a silicon micro-vertex detector using the flip-chip bonding method
Author :
Saitoh, Y. ; Yamanaka, J. ; Suzuki, H. ; Miyahara, S. ; Kamiya, M. ; Kadoi, K. ; Masusda, T. ; Maemura, K. ; Inoue, M. ; Suzuki, A. ; Takeuchi, H. ; Mandai, M. ; Kanazawa, H. ; Higashi, Y. ; Ikeda, H. ; Koike, S. ; Matsuda, T. ; Ozaki, H. ; Tanaka, M. ; T
Author_Institution :
SEIKO Instrum. Inc., Chiba, Japan
Abstract :
Full-size models of a detector unit for a silicon microvertex detector for the KEK B factory have been built. The model consists of four dummy double-sided, double-metal silicon microstrip detectors and two silicon end-boards mounted with dummy readout VLSIs on both sides. In this trial the flip-chip bonding method, using an anisotropic conductive film, is applied to both sides of the detector unit to bond 640 strips at a pitch of 50 μm
Keywords :
semiconductor counters; semiconductor technology; Si microvertex detector; VLSIs; assembly techniques; double-metal; double-sided; flip-chip bonding method; Anisotropic conductive films; Assembly; Bonding; Bridges; Decision support systems; Detectors; Silicon; Strips; Very large scale integration; Wire;
Conference_Titel :
Nuclear Science Symposium and Medical Imaging Conference, 1992., Conference Record of the 1992 IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0884-0
DOI :
10.1109/NSSMIC.1992.301207
