DocumentCode :
1928113
Title :
Contactless Slipring System based on rotating magnetic field principle for rotary applications
Author :
Abdolkhani, Ali ; Hu, Aiguo Patrick ; Covic, Grant A. ; Moridnejad, Mahsa
Author_Institution :
Dept. of Electr. & Comput. Eng, Univ. Of Auckland, Auckland, New Zealand
fYear :
2013
fDate :
15-19 Sept. 2013
Firstpage :
2566
Lastpage :
2573
Abstract :
This paper presents a Contactless Slipring System (CSS) based on rotating magnetic field theory for transferring electrical power to a rotatable shaft. Besides the analytical expressions, a 3-D FEM (Finite Element Model) is developed for simulation study, and a practical circuit is built for system verification and performance evaluation. A method of canceling the rotational torque associated with the rotating magnetic field is proposed and practically verified by testing the prototype system. It has been shown that the proposed system can transfer power up to about 950W to the load at the secondary circuit with a practically achievable quality factor Qs of 5. The FEM simulation and practical results show that unlike the conventional rotating transformer solution, the added magnetic shield increases the power transfer capability by 20%. The uncompensated power receivable at the secondary is 157 VA and 198 VA for the cases without and with aluminum shield respectively.
Keywords :
finite element analysis; inductive power transmission; magnetic fields; performance evaluation; power transformers; 3-D FEM; FEM simulation; aluminum shield; contactless slipring system; electrical power; finite element model; inductive power transfer technology; magnetic shield; performance evaluation; power 950 W; power transfer capability; quality factor; rotary applications; rotatable shaft; rotating magnetic field; rotating magnetic field principle; rotating transformer solution; secondary circuit; Aluminum; Coils; Contacts; Integrated circuit modeling; Magnetic fields; Shafts; Windings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Congress and Exposition (ECCE), 2013 IEEE
Conference_Location :
Denver, CO
Type :
conf
DOI :
10.1109/ECCE.2013.6647032
Filename :
6647032
Link To Document :
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