• DocumentCode
    1930367
  • Title

    Laser ablation inside transparent thin films

  • Author

    Kumar, Kush ; Lee, Kenneth K. C. ; Li, Jie ; Nogami, J. ; Herman, Peter R. ; Kherani, Nazir P.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Toronto, Toronto, ON, Canada
  • fYear
    2013
  • fDate
    12-16 May 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The laser interactions and processing of thin films is a rapidly growing area of research that serves broadly in microelectronic, display, photovoltaic, sensing and biological applications. Traditional concepts of laser marking, machining and scribing in opaque materials have been widely extended into transparent substrates or films to enable new approaches in printing or manufacturing by laser induced forward transfer (LIFT) [1] and other novel directions for catapulting single cells [2] and forming blisters [3] or microfluidic structures [4]. These approaches typically rely on inducing strong laser-plasma interactions internally at the interface of two media. In contrast, nonlinear optical interactions can be more flexibly positioned within the focal volume of short-pulsed lasers to drive new approaches for welding, writing optical circuits, or shaping three-dimensional opto-fluidic circuits inside transparent materials.
  • Keywords
    high-speed optical techniques; laser ablation; nanofabrication; nanostructured materials; silicon compounds; thin films; Gaussian profiles; SiNx; SiOx; femtosecond fiber laser; frequency 100 kHz; interface machining; internal machining; laser ablation; nanostructured materials; surface machining; time 170 fs; transparent thin films; Etching; Films; Lasers; Machining; Silicon; Ultrafast optics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Europe (CLEO EUROPE/IQEC), 2013 Conference on and International Quantum Electronics Conference
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4799-0593-5
  • Type

    conf

  • DOI
    10.1109/CLEOE-IQEC.2013.6801557
  • Filename
    6801557