DocumentCode
1930367
Title
Laser ablation inside transparent thin films
Author
Kumar, Kush ; Lee, Kenneth K. C. ; Li, Jie ; Nogami, J. ; Herman, Peter R. ; Kherani, Nazir P.
Author_Institution
Dept. of Mater. Sci. & Eng., Univ. of Toronto, Toronto, ON, Canada
fYear
2013
fDate
12-16 May 2013
Firstpage
1
Lastpage
1
Abstract
The laser interactions and processing of thin films is a rapidly growing area of research that serves broadly in microelectronic, display, photovoltaic, sensing and biological applications. Traditional concepts of laser marking, machining and scribing in opaque materials have been widely extended into transparent substrates or films to enable new approaches in printing or manufacturing by laser induced forward transfer (LIFT) [1] and other novel directions for catapulting single cells [2] and forming blisters [3] or microfluidic structures [4]. These approaches typically rely on inducing strong laser-plasma interactions internally at the interface of two media. In contrast, nonlinear optical interactions can be more flexibly positioned within the focal volume of short-pulsed lasers to drive new approaches for welding, writing optical circuits, or shaping three-dimensional opto-fluidic circuits inside transparent materials.
Keywords
high-speed optical techniques; laser ablation; nanofabrication; nanostructured materials; silicon compounds; thin films; Gaussian profiles; SiNx; SiOx; femtosecond fiber laser; frequency 100 kHz; interface machining; internal machining; laser ablation; nanostructured materials; surface machining; time 170 fs; transparent thin films; Etching; Films; Lasers; Machining; Silicon; Ultrafast optics;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Europe (CLEO EUROPE/IQEC), 2013 Conference on and International Quantum Electronics Conference
Conference_Location
Munich
Print_ISBN
978-1-4799-0593-5
Type
conf
DOI
10.1109/CLEOE-IQEC.2013.6801557
Filename
6801557
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