Title :
A high-rejection substrate integrated waveguide filter for Q-LINKPAN applications
Author :
Wu, Tao ; Hong, Wei ; Chen, Jixin
Author_Institution :
State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
Abstract :
In this paper, a compact high-rejection substrate integrated waveguide (SIW) bandpass filter with a pair of finite transmission zeros (TZs) is presented for the Q-LINKPAN application. This filter consists of six cascaded cavities and a cross-coupling structure on the basis of a single-layer SIW. A folded topology of cavities make the cross-coupling path could be achieved easily between two non-neighboring cavities, which dramatically enhance the frequency selectivity. The designed filter has been fabricated using standard PCB process. The measured results exhibit an insertion loss of 2 dB at the center frequency of 42GHz, a return loss of more than 23dB over the passband (40.5GHz-43.5GHz), a 40dB rejection bandwidth of 6.5GHz (~15.5%) and an excellent frequency selectivity, which are in good agreement with simulated results. This filter has advantages of planar structure, low-cost, small size, easy be integrated with planar circuits, etc. It could be a good candidate for millimeter applications.
Keywords :
band-pass filters; millimetre wave filters; personal area networks; printed circuits; substrate integrated waveguides; waveguide filters; Q-LINKPAN; SIW bandpass filter; bandwidth 6.5 GHz; cascaded cavity; cross-coupling path structure; finite transmission zeros; folded topology; frequency 40.5 GHz to 43.5 GHz; high-rejection substrate integrated waveguide filter; planar circuit structure; return loss; single-layer SIW; standard PCB process; Band pass filters; Cavity resonators; Filtering theory; Loss measurement; Microstrip filters; Microwave filters; Substrates; Bandpass filter (BPF); Q-LINKPAN; cross-coupling filter; substrate integrated waveguide (SIW);
Conference_Titel :
Microwave Workshop Series on Millimeter Wave Wireless Technology and Applications (IMWS), 2012 IEEE MTT-S International
Conference_Location :
Nanjing
Print_ISBN :
978-1-4673-0901-1
Electronic_ISBN :
978-1-4673-0903-5
DOI :
10.1109/IMWS2.2012.6338221