DocumentCode
1936149
Title
Packaging of silicon pressure sensors for home appliances
Author
Ampabadal, F. ; Carreras, Lluís ; Arrieta, María Jesús
Author_Institution
Centre Nacional de Microelectron., CSIC, Barcelona, Spain
fYear
2005
fDate
2-4 Feb. 2005
Firstpage
589
Lastpage
591
Abstract
In this paper a packaging technology proposal for piezoresistive pressure sensors is presented which is mainly characterized by its low cost. Assembly of the pressure device is made by direct adhesion of the silicon die on standard PCB and protection against aggressive media is obtained by using thermally cured silicone gel. Characterization of the packaged sensors has shown that when using a suitable signal-conditioning circuitry the sensor microsystem performance is adequate for its use in home appliances.
Keywords
elemental semiconductors; microsensors; packaging; piezoresistive devices; pressure sensors; Si; home appliances; packaging technology; piezoresistive pressure sensors; pressure device; sensor microsystem performance; silicon die; silicon pressure sensors; silicone gel; Adhesives; Assembly; Costs; Home appliances; Packaging; Piezoresistance; Proposals; Protection; Sensor phenomena and characterization; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices, 2005 Spanish Conference on
Conference_Location
Tarragona
Print_ISBN
0-7803-8810-0
Type
conf
DOI
10.1109/SCED.2005.1504524
Filename
1504524
Link To Document