Title :
ArF resist CD shrinkage induced by defect inspection
Author_Institution :
United Microelectronics Corporation, No 3, Li-Hsin Rd II, Hsinchu Science Park, Taiwan
Abstract :
Start writing your paper here. This is a two column format. EXACTLY one page is for text and EXACTLY one page is for graphics. You need not fill the pages. The second page is reserved for graphs, figures, photographs, etc. Only two pages will be shared with the evaluators.
Keywords :
Collaboration; Facsimile; Inspection; Microelectronics; Production; Resists; Writing; ADI; CD shrinkage; UV light; contraction; defect inspection; yield drop;
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2012
Conference_Location :
HsinChu, Taiwan
Print_ISBN :
978-1-4673-4540-8
DOI :
10.1109/eMDC.2012.6338430
