Title :
Electron-beam MCM substrate tester
Author :
Brunner, M. ; Schmid, R.
Author_Institution :
Siemens Corp. Res., Munich, Germany
Abstract :
An electron beam MCM substrate tester that is now installed in a fabrication line is discussed. It provides a spot size of below 25-μm to probe pads in a 30 cm×30 cm field without mechanical movement. The test speed is 1000 networks in 15 s. The tester is automated for fabrication environment and ease of operation. Several hundred substrates have already been tested on the system while not missing any defect
Keywords :
automatic testing; electron beam testing; integrated circuit testing; multichip modules; printed circuit manufacture; printed circuit testing; substrates; 15 s; PCB testing; electron beam MCM substrate tester; electron beam testing; multichip module technology; printed circuit board; probe pads; spot size; test speed; Automatic optical inspection; Automatic testing; Circuit testing; Electron beams; Fabrication; Nails; Pins; Probes; Surface-mount technology; Voltage;
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
DOI :
10.1109/MCMC.1993.302150
