Title :
Analysis of multi-layered irregular power distribution planes with vias using transmission matrix method
Author :
Kim, Joong-Ho ; Swaminathan, Madhavan
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed
Keywords :
frequency-domain analysis; matrix algebra; power supply circuits; decoupling capacitors; frequency domain analysis; multi-layered power distribution planes; multiple power/ground plane pairs; mutual inductors; self-inductors; transmission matrix; vertical vias; Capacitors; Conductors; Copper; Coupling circuits; Dielectric losses; Impedance; Inductance; Paramagnetic resonance; Permittivity; Power distribution;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967647
