Title :
Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures
Author :
Wang, Yong ; Jandhyala, Vikram ; Shi, C. J Richard
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Abstract :
This paper presents a triangular surface mesh-based formulation of the Partial Element Equivalent Circuit (PEEC) approach. Rao-Wilton-Glisson (RWG) basis functions defined on triangular tessellations are used to model arbitrarily-shaped conducting structures via SPICE compatible netlists. This approach is potentially useful for modeling on-chip electromagnetic interactions
Keywords :
SPICE; circuit simulation; conducting bodies; equivalent circuits; mesh generation; Rao-Wilton-Glisson basis functions; SPICE model; conducting structure; coupled electromagnetic-circuit simulation; on-chip electromagnetic interactions; partial element equivalent circuit; surface mesh; triangular tessellation; Conductors; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Impedance; Integrated circuit interconnections; SPICE; Sparse matrices; Surface resistance; Voltage control;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967653
