• DocumentCode
    19388
  • Title

    Millimeter-Wave Small-Signal Model Using A Coplanar Waveguide De-Embedded Sub-Model for HEMT

  • Author

    Tung The-Lam Nguyen ; Sam-Dong Kim

  • Author_Institution
    Div. of Electron. & Electr. Eng., Dongguk Univ., Seoul, South Korea
  • Volume
    24
  • Issue
    2
  • fYear
    2014
  • fDate
    Feb. 2014
  • Firstpage
    99
  • Lastpage
    101
  • Abstract
    We propose in this study an approach to highly reliable extraction method for parasitic elements of the 0.1 μm GaAs metamorphic high electron mobility transistors. This method utilizes the de-embedding scheme for the coplanar waveguide (CPW) feeding structure by considering the distributed extrinsic parasitic elements in our small-signal model. The parasitic extrinsic capacitances are determined by modeling a PI equivalent circuit including the interaction between the sub-model (the model after de-embedding) and the CPW feedings. Extractions for the parasitic elements are performed at four different gate widths ( 2×10 μm, 2×20 μm, 2×30 μm, and 2×70 μm), and our S-parameter prediction shows the best agreement with the measurements in a frequency range of 0.5-110 GHz (0.5 GHz step) among the small-signal models reported to date.
  • Keywords
    III-V semiconductors; S-parameters; capacitance; coplanar waveguides; gallium arsenide; high electron mobility transistors; millimetre wave field effect transistors; semiconductor device models; GaAs; GaAs metamorphic high electron mobility transistors; HEMT; PI equivalent circuit; S-parameter prediction; coplanar waveguide de-embedded sub-model; coplanar waveguide feeding structure; de-embedding scheme; distributed extrinsic parasitic elements; frequency 0.5 GHz to 110 GHz; highly reliable extraction method; millimeter-wave small-signal model; parasitic extrinsic capacitances; size 0.1 mum; Coplanar waveguides; Equivalent circuits; Frequency measurement; Integrated circuit modeling; Logic gates; mHEMTs; Field effect transistors (FETs); linear and non-linear device modeling; microwave device characterization and measurements;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2013.2290214
  • Filename
    6680704