Title :
Compact thermal-interaction model for dynamic within chip temperature determination by circuit simulation
Author :
Ishiguro, K. ; Ueno, A. ; Toda, A. ; Miyake, M. ; Mattausch, H.J. ; Miura-Mattausch, M. ; Matsuzawa, K. ; Iizuka, T. ; Yamaguchi, S. ; Hoshida, T. ; Kinoshita, A. ; Arakawa, T.
Author_Institution :
Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
Abstract :
We report an equivalent circuit for capturing the thermal propagation from a heat source, creating thermal energy by the self-heating effect, to other devices during circuit operation. It is verified that the equivalent circuit reproduces measured transient thermal propagation characteristics for different layouts. The test structures are also applied to extract the magnitude of the elements included in the equivalent circuit.
Keywords :
circuit simulation; equivalent circuits; thermal analysis; chip temperature; circuit simulation; compact thermal-interaction model; equivalent circuit; heat source; self-heating effect; thermal energy; thermal propagation; Atmospheric measurements; Heating; Logic gates; Particle measurements; Receivers; Semiconductor device measurement; Temperature measurement;
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1027-7
DOI :
10.1109/ICMTS.2012.6190643