DocumentCode :
1942070
Title :
Compact thermal-interaction model for dynamic within chip temperature determination by circuit simulation
Author :
Ishiguro, K. ; Ueno, A. ; Toda, A. ; Miyake, M. ; Mattausch, H.J. ; Miura-Mattausch, M. ; Matsuzawa, K. ; Iizuka, T. ; Yamaguchi, S. ; Hoshida, T. ; Kinoshita, A. ; Arakawa, T.
Author_Institution :
Grad. Sch. of Adv. Sci. of Matter, Hiroshima Univ., Higashi-Hiroshima, Japan
fYear :
2012
fDate :
19-22 March 2012
Firstpage :
187
Lastpage :
190
Abstract :
We report an equivalent circuit for capturing the thermal propagation from a heat source, creating thermal energy by the self-heating effect, to other devices during circuit operation. It is verified that the equivalent circuit reproduces measured transient thermal propagation characteristics for different layouts. The test structures are also applied to extract the magnitude of the elements included in the equivalent circuit.
Keywords :
circuit simulation; equivalent circuits; thermal analysis; chip temperature; circuit simulation; compact thermal-interaction model; equivalent circuit; heat source; self-heating effect; thermal energy; thermal propagation; Atmospheric measurements; Heating; Logic gates; Particle measurements; Receivers; Semiconductor device measurement; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on
Conference_Location :
San Diego, CA
ISSN :
1071-9032
Print_ISBN :
978-1-4673-1027-7
Type :
conf
DOI :
10.1109/ICMTS.2012.6190643
Filename :
6190643
Link To Document :
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