EXTIGATE: The Ultimate Process Architecture for sub-0.25μm CMOS Technologies

In this work we present the novel process architecture EXTIGATE (EXtended Trench Isolation GAte TEchnology) which solves major problems associated with shallow-trench-isolation (STI) and n⁺/p⁺ dual workfunction gate technology. These achievements are realized without any increase in process complexity or cost. Furthermore, the process window is enlarged leading to an extremely robust CMOS process.