DocumentCode :
1943557
Title :
Impact of Thickness and Deposition Temperature of Gate Dielectric on Valence Bands in Silicon Nanowires
Author :
Xu, Honghua ; He, Yuhui ; Fan, Chun ; Zhao, Yuning ; Du, Gang ; Kang, Jinfeng ; Han, Ruqi ; Liu, Xiaoyan
Author_Institution :
Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
fYear :
2009
fDate :
9-11 Sept. 2009
Firstpage :
1
Lastpage :
4
Abstract :
The strain distribution and strained valence band structure in silicon nanowire with varied thicknesses and deposition temperatures of gate dielectric are discussed in detail in this work. Our calculation indicates that valence subbands are dependent on the structure and process parameters. Strain has little effects in (001) orientation. But in Si (110) nanowire, the valence subbands shift upper and warp remarkably as the gate dielectric becomes thicker. Taking thermal residual strain into consideration, the strained valence subbands go to higher energy positions compared to NW without the residual strain. The different deposition temperature by a certain process slightly influences the valence bands. Strain effects on densities of states and effective masses are also investigated.
Keywords :
dielectric materials; effective mass; electronic density of states; elemental semiconductors; hafnium compounds; nanowires; semiconductor quantum wires; silicon; silicon compounds; valence bands; Si-HfO2; Si-SiO2; densities of states; deposition temperature; effective masses; gate dielectrics; silicon nanowires; strain distribution; strain effects; strained valence band structure; thermal residual strain; valence subbands; Capacitive sensors; Dielectric devices; Effective mass; Hafnium oxide; Microelectronics; Nanowires; Silicon; Temperature distribution; Tensile strain; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location :
San Diego, CA
ISSN :
1946-1569
Print_ISBN :
978-1-4244-3974-8
Electronic_ISBN :
1946-1569
Type :
conf
DOI :
10.1109/SISPAD.2009.5290203
Filename :
5290203
Link To Document :
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