Title :
Flexible opto-electronic circuit board for in-device interconnection
Author :
Shibata, Tomoaki ; Takahashi, Atsushi
Author_Institution :
Adv. Mater. R&D Center, Hitachi Chem. Co. Ltd., Tsukuba
Abstract :
We propose a flexible opto-electronic circuit board (FOECB) for in-device interconnection, which is combined with a flexible printed circuit (FPC) with flexible optical waveguides having 45deg mirrors for 90deg beam turning using adhesive film. The fabricated prototype shows total optical loss of 3.7 dB, and the prototype, which mounted a 4-ch vertical-cavity surface-emitting laser (VCSEL) array and a 4-ch photodiode (PD) array, successfully demonstrated optical signal transmission at a data rate of 10 Gbps/ch. These results show that the proposed prototype has considerable potential to realize practical FOECB for in-device interconnection.
Keywords :
interconnections; optical losses; optical waveguides; photodiodes; printed circuits; adhesive film; beam turning; flexible optical waveguides; flexible opto-electronic circuit board; flexible printed circuit; in-device interconnection; optical loss; optical signal transmission; photodiode array; vertical-cavity surface-emitting laser array; Flexible printed circuits; Integrated circuit interconnections; Laser beams; Mirrors; Optical arrays; Optical films; Optical interconnections; Optical waveguides; Prototypes; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4549980