DocumentCode :
1945660
Title :
A wafer-integrated array of micromachined electrostatically-driven ultrasonic resonators for microfluidic applications
Author :
Parviz, B.A. ; Chou, T.-K. ; Zhang, C. ; Najafi, K. ; Muller, M.O. ; Bernal, Luis P. ; Washabaugh, P.
Author_Institution :
Center for Integrated MicroSyst., Michigan Univ., Ann Arbor, MI, USA
fYear :
2000
fDate :
23-27 Jan 2000
Firstpage :
34
Lastpage :
39
Abstract :
A distributed micromachined ultrasound source is presented. Electrostatic actuators operating at frequencies exceeding 100 kHz are coupled to a Helmholtz resonator in order to achieve high output velocities. They consist of a 1200 μm×1200 μm×1.36 μm composite diaphragm, a perforated P++ backplate and a 3 μm air gap. The actuators cover the entire surface of a 4" wafer and are grouped in four individually addressable quadrants. A robust micromachining technology with >80% yield, employing anodic glass-silicon bonding, dissolved wafer process and advanced deep silicon etching has been developed for fabrication of the actuator array. The dynamic behavior of the diaphragm was studied using laser interferometry, and operation was verified at 96 kHz by acoustic measurement
Keywords :
acoustic radiators; acoustic resonators; acoustic streaming; diaphragms; electrostatic actuators; microfluidics; micromachining; micromechanical resonators; sputter etching; ultrasonic arrays; wafer bonding; 1.36 micron; 1200 micron; 96 kHz; Helmholtz resonator; Si; advanced deep silicon etching; air gap; anodic glass-silicon bonding; array fabrication; composite diaphragm; dissolved wafer process; distributed micromachined ultrasound source; dynamic behavior; electrostatic actuators; electrostatically-driven ultrasonic resonators; flow models; high output velocity; individually addressable quadrants; laser interferometry; microfluidic applications; perforated P++ backplate; robust micromachining technology; wafer-integrated array; Electrostatic actuators; Etching; Frequency; Interferometry; Micromachining; Optical device fabrication; Robustness; Silicon; Ultrasonic imaging; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on
Conference_Location :
Miyazaki
ISSN :
1084-6999
Print_ISBN :
0-7803-5273-4
Type :
conf
DOI :
10.1109/MEMSYS.2000.838486
Filename :
838486
Link To Document :
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