The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints

Author

Arfaei, B. ; Xing, Y. ; Woods, J. ; Wolcott, J. ; Tumne, P. ; Borgesen, P. ; Cotts, E.

Author_Institution

Phys. & Mater. Sci., Binghamton Univ., Binghamton, NY

fYear

2008

fDate

27-30 May 2008

Firstpage

459

Lastpage

465

Abstract

A study of the dependence of room temperature shear fatigue lifetime of SnAgCu solder joints on Sn grain number and orientation was conducted. Both essentially single Sn grain and multi (two or three) Sn grain samples are found in many SnAgCu solder joints in the field, and these Sn grain morphologies were examined here. The mean fatigue lifetime was found to be significantly longer for samples with multiple Sn grains than for samples with single Sn grains. For single grain samples, correlations between Sn grain orientation (with respect to the loading direction) and lifetime were observed, providing insight on early failures in SnAgCu solder joints.

Keywords

copper alloys; crystal microstructure; crystal orientation; silver alloys; solders; tin; tin alloys; Sn grain number; SnAgCu; grain morphologies; orientation; shear fatigue life; single grain samples; solder joints; Fatigue; Intermetallic; Joining materials; Metallization; Microstructure; Morphology; Soldering; Testing; Thermomechanical processes; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550012

Filename

4550012