Comparison and analysis of integrated passive device technologies for wireless radio frequency module

Author

Kundu, Arun Chandra ; Megahed, Mohamed ; Schmidt, Dominik

Author_Institution

Ultra Mobility Group, Intel Corp., Chandler, AZ

fYear

2008

fDate

27-30 May 2008

Firstpage

683

Lastpage

687

Abstract

We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of cost, size, performance & technology maturity, it comes out that silicon, glass & LTCC are the suitable technologies. We have designed IPDs using these technologies having same foot print to satisfy Intel Wi-MAX specs. Have taped out, validated the samples and made an electrical performance and cost comparison among three technologies. Result shows that Si_IPD & Glass_IPD both have well enough electrical performance required for Wi_MAX solution at lower cost and equivalent size compared to LTCC.

Keywords

WiMax; radiofrequency integrated circuits; system-in-package; WiMAX; discrete radio frequency; integrated passive device; low-temperature cofired ceramic technology; system-in-package; wireless radio frequency module; Capacitance; Costs; Foot; Glass; Inductors; Integrated circuit technology; Packaging; Q factor; Radio frequency; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550046

Filename

4550046