DocumentCode :
1946499
Title :
Band-pass-filter with balun function from IPD technology
Author :
Liu, Kai ; Frye, Robert ; Emigh, Roger
Author_Institution :
STATS ChipPAC, Inc., Tempe, AZ
fYear :
2008
fDate :
27-30 May 2008
Firstpage :
718
Lastpage :
723
Abstract :
Band-pass-filters (BPF) and baluns are critical components in the RF channels. Conventional discrete component solutions, like those from LTCC technology, use separate parts for these two functions. As miniaturization is becoming a trend for cost-reduction of wireless products, there is a need to make these devices in smaller form-factors. Integrated passive devices (IPD) technology, using Silicon wafer process techniques, enables smaller form-factor components for RF applications. Typically, compared to discrete LTCC parts, an IPD BPF can be three to five times smaller, and an IPD balun can be two times smaller. We have not only achieved smaller IPDs for these individual function blocks, but have also combined two function-blocks to create a single integrated component, which further reduces the overall size while maintaining good electrical performance. An advanced design methodology has been adopted based on EM simulation for making these IPDs. Good correlation is seen between simulation and test, and the result is that first- run pass has been achieved in the majority of our designs.
Keywords :
baluns; band-pass filters; network synthesis; Conventional discrete component solutions; EM simulation; RF channels; balun function; band-pass-filter; discrete LTCC parts; integrated passive devices technology; silicon wafer process techniques; Band pass filters; Capacitors; Circuit topology; Impedance matching; Inductors; Magnetic separation; Radio frequency; Silicon; Switches; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
ISSN :
0569-5503
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2008.4550052
Filename :
4550052
Link To Document :
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