Development and performance characterizations of a QFN/HMT package

Author

Lai, Yi-Shao ; Chang-Chien, Pao-Huei ; Chang, Chi-Wen ; Tsai, Tsung-Yueh ; Hung, Sung-Ching ; Tseng, Andy ; Takai, Keiji ; Hirashima, Tetsuyuki

Author_Institution

Adv. Semicond. Eng., Inc., Kaohsiung

fYear

2008

fDate

27-30 May 2008

Firstpage

964

Lastpage

967

Abstract

In this paper, application advantages, development, and fabrication process of aQFN/HMT is introduced. Identical functions are intentionally designed in both CSP- BGA and aQFN/HMT packaging structures so that thermal and electrical performances of these two structures can be reasonably compared and demonstrated. Our calculations indicate that thermal and electrical performances of aQFN/HMT are much better than CSP-BGA, when the same functions are designed in.

Keywords

integrated circuit manufacture; integrated circuit packaging; thermal management (packaging); BGA-type CSP comparison; aQFN-HMT fabrication process; aQFN-HMT package performance characterization; advanced quad flat no-lead package; hybrid manufacturing technologies; package electrical performance; package thermal performance; Chip scale packaging; Costs; Electronic packaging thermal management; Electronics packaging; Etching; Fabrication; Lead; Semiconductor device packaging; Thermomechanical processes; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2008. ECTC 2008. 58th

Conference_Location

Lake Buena Vista, FL

ISSN

0569-5503

Print_ISBN

978-1-4244-2230-2

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2008.4550092

Filename

4550092