• DocumentCode
    1947743
  • Title

    Study of the mechanisms of spectral broadening in high power semiconductor laser arrays

  • Author

    Liu, Xingsheng ; Wang, Jingwei ; Wei, Peiyong

  • Author_Institution
    State Key Lab. of Transient Opt. & Photonics, Chinese Acad. of Sci., Xi´´an
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    1005
  • Lastpage
    1010
  • Abstract
    High power semiconductor laser arrays have found increased applications in pumping of solid state laser systems for industrial, military and medical applications as well as direct material processing applications such as welding, cutting, and surface treatment. Semiconductor laser array products are required to have narrow spectral width for applications. Increasing the spectral accuracy by reducing the spectral width of the pump diode enables the laser system designer to improve the laser system compactness, efficiency, power, and beam quality while at the same time reducing thermal management cost in the system. Spectral width is one of the key specifications of laser array products and it is very important to improve the spectral performance to improve production yield, reduce cost and gain competitiveness. In this paper, we study the mechanisms of spectral broadening in high power semiconductor laser arrays.
  • Keywords
    semiconductor laser arrays; thermal management (packaging); beam quality; high power semiconductor laser array; laser system compactness; laser system efficiency; laser system power; production yield; pump diode; spectral accuracy; spectral broadening; thermal management; Costs; Defense industry; Laser beam cutting; Laser excitation; Optical arrays; Power lasers; Pump lasers; Semiconductor laser arrays; Solid lasers; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550099
  • Filename
    4550099