• DocumentCode
    1948152
  • Title

    Power transmission lines: A new interconnect design to eliminate simultaneous switching noise

  • Author

    Engin, A. Ege ; Swaminathan, Madhavan

  • Author_Institution
    Microsyst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    1139
  • Lastpage
    1143
  • Abstract
    A major bottleneck in high-speed signaling is the simultaneous switching noise (SSN), which is caused by simultaneously switching output buffers. SSN is a result of the coupling between the signal lines and the power delivery network (PDN) in off-chip signaling. This coupling occurs at discontinuities of the transmission line, wherever there is an interruption of the current return path. A particular location where there is a return path discontinuity is the output buffer that is connected to a transmission line. To reduce this discontinuity, current designs try to maintain a low- impedance PDN for the I/O lines up to the output buffers on the chip. This requires a complicated design of the package and interconnections using, for example, planes for the PDN and decoupling capacitors on the package. For GHz signaling, it can be very difficult to maintain sufficiently low impedance. This paper presents a new PDN design, called as the power transmission line, which overcomes these problems.
  • Keywords
    power transmission lines; signalling; current return path interruption; high-speed signaling; interconnect design; off-chip signaling; power delivery network; power transmission lines; simultaneous switching noise elimination; switching output buffers; Capacitors; Couplings; Distributed parameter circuits; Impedance; Integrated circuit interconnections; Packaging; Power supplies; Power transmission lines; Resonance; Transmission line discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550119
  • Filename
    4550119