• DocumentCode
    1949455
  • Title

    Fracture mechanics study of fatigue crack growth in solder joints under drop impact

  • Author

    Wang, Jason ; Seah, S.K.W. ; Wong, E.H. ; Cadge, D.

  • Author_Institution
    WorleyParsons Pte. Ltd., Singapore
  • fYear
    2008
  • fDate
    27-30 May 2008
  • Firstpage
    1601
  • Lastpage
    1605
  • Abstract
    This paper describes the use of a fracture mechanics-based modeling approach to explain two interesting experimental observations in solder joints subjected to high speed cyclic bending, namely 1) the evolution of the crack front from a positive to a negative curvature; and 2) the initial acceleration and the subsequent retardation of the crack growth rate. Two- dimensional crack fronts in the solder joint were modeled, and J-integral along the crack front was computed. The modeling results have provided physical insights into the experimentally observed crack growth phenomena.
  • Keywords
    bending; fatigue cracks; fracture mechanics; impact (mechanical); materials testing; solders; J-integral; crack growth rate; drop impact; fatigue crack growth; fracture mechanics; high speed cyclic bending; solder joints; Assembly; Capacitive sensors; Circuit testing; Fatigue; Frequency; Integrated circuit interconnections; Integrated circuit testing; Soldering; Strain measurement; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
  • Conference_Location
    Lake Buena Vista, FL
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-2230-2
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2008.4550190
  • Filename
    4550190