DocumentCode
1949455
Title
Fracture mechanics study of fatigue crack growth in solder joints under drop impact
Author
Wang, Jason ; Seah, S.K.W. ; Wong, E.H. ; Cadge, D.
Author_Institution
WorleyParsons Pte. Ltd., Singapore
fYear
2008
fDate
27-30 May 2008
Firstpage
1601
Lastpage
1605
Abstract
This paper describes the use of a fracture mechanics-based modeling approach to explain two interesting experimental observations in solder joints subjected to high speed cyclic bending, namely 1) the evolution of the crack front from a positive to a negative curvature; and 2) the initial acceleration and the subsequent retardation of the crack growth rate. Two- dimensional crack fronts in the solder joint were modeled, and J-integral along the crack front was computed. The modeling results have provided physical insights into the experimentally observed crack growth phenomena.
Keywords
bending; fatigue cracks; fracture mechanics; impact (mechanical); materials testing; solders; J-integral; crack growth rate; drop impact; fatigue crack growth; fracture mechanics; high speed cyclic bending; solder joints; Assembly; Capacitive sensors; Circuit testing; Fatigue; Frequency; Integrated circuit interconnections; Integrated circuit testing; Soldering; Strain measurement; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location
Lake Buena Vista, FL
ISSN
0569-5503
Print_ISBN
978-1-4244-2230-2
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2008.4550190
Filename
4550190
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