Extremely-compact and high-performance (160Gbps = 20GB/s) optical semiconductor module using lead frame embedded optoelectronic ferrule

A high-performance 160 Gbps (=20 GB/s) optical semiconductor module using an optoelectronic (OE) ferrule with the ultra-compact size of 4.4 times 4.5 times 1.0 mm³ was developed for the first time in the world. The ferrule is used as the interface of OE converter in our developed optoelectronic LSI package of over 1 Tbps, POST LSI package (post-reflow optical-interface stacking technique LSI package). The feature of this OE ferrule is to have fine-pitch lead frame electrodes formed by insert molding method, which realized highly reliable electric contacts and excellent electric characteristics of the module. Moreover, the high-density assembly of 12 ch optical semiconductor module coupling an optical semiconductor device and an optical fiber array was realized by a simple assembly process with high accuracy and high reliability.