Title :
3D strip meander delay line structure for multilayer LTCC-based SiP applications
Author :
Kim, Gawon ; Lu, Albert Chee W ; Wei, Fan ; Wai, Lai L. ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejeon
Abstract :
Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND) vias. We will show the simulated results using EM and circuit simulator.
Keywords :
ceramic packaging; coaxial cables; delay lines; system-in-package; 3D LTCC-based SiP; 3D delay lines; 3D strip meander delay line structure; QCOX-GND vias; circuit simulator; coaxial line; multilayer LTCC; quasi coaxial ground vias; timing delay; Circuit simulation; Crosstalk; Delay lines; Integrated circuit interconnections; Nonhomogeneous media; Shape measurement; Signal design; Strips; Substrates; Timing jitter;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4550271
