Title :
Conductive lithographic films
Author :
Ramsey, B.J. ; Evans, P.S.A. ; Harrison, D.
Author_Institution :
Dept. of Design, Brunel Univ., Egham, UK
Abstract :
This paper reports progress in the development of a novel fabrication technique for printing circuit board designs directly onto suitable substrates. Circuit tracks can be formed on organic or synthetic substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. The application of this work is in substitutes for conventional (copper-clad resin/laminate) circuit boards where, for low complexity circuits, directly printed substrates offer cost advantages and environmental benefits. The paper is a resume of work and results, including; ink formulation, environmental test, circuit modelling and life cycle analysis. Conductive lithographic films have now been successfully demonstrated in a telephone handset developed in conjunction with Nortel, microprocessor and microwave stripline applications. Whilst developed primarily as a low cost, low environmental impact alternative to subtractive PCB manufacture, other potential advantages such as flexibility and environmental robustness are apparent
Keywords :
environmental testing; life testing; photolithography; printed circuit manufacture; thin films; PCB designs; circuit modelling; conductive lithographic films; directly printed substrates; environmental benefits; environmental test; fabrication technique; ink formulation; life cycle analysis; lithographic printing process; metal-loaded ink; organic substrates; printing circuit boards; synthetic substrates; Circuit testing; Conductive films; Costs; Fabrication; Ink; Laminates; Printed circuits; Printing; Resins; Resumes;
Conference_Titel :
Electronics and the Environment, 1997. ISEE-1997., Proceedings of the 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3808-1
DOI :
10.1109/ISEE.1997.605330