DocumentCode :
1953021
Title :
Self-heating in high performance bipolar transistors fabricated on SOI substrates
Author :
Ganci, P.R. ; Hajjar, J.-J.J. ; Clark, T. ; Humphries, P. ; Lapham, J. ; Buss, D.
Author_Institution :
Semicond. Div., Analog Devices Inc., Wilmington, MA, USA
fYear :
1992
fDate :
13-16 Dec. 1992
Firstpage :
417
Lastpage :
420
Abstract :
The effects of self-heating on the characteristics of bipolar transistors fabricated on silicon-on-insulator (SOI) substrates are discussed through measurements and simulations. It is shown that the SOI substrate´s buried oxide affects the thermal characteristics of the transistor. A three fold increase in thermal resistivity is observed on transistors fabricated on SOI substrates over identical transistors fabricated on regular silicon substrates. Moreover, thermal gradients within the device footprint are also discussed and evaluated both experimentally and using MEDICI simulations. Finally, a simple thermal model is presented which predicts transistor characteristics with good accuracy.<>
Keywords :
SPICE; bipolar transistors; digital simulation; semiconductor device models; semiconductor-insulator boundaries; MEDICI simulations; SOI substrates; buried oxide; device footprint; high performance bipolar transistor; self-heating; thermal characteristics; thermal gradients; thermal model; thermal resistivity; transistor characteristics; Bipolar transistors; SPICE; Semiconductor device modeling; Semiconductor-insulator interfaces; Simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0817-4
Type :
conf
DOI :
10.1109/IEDM.1992.307391
Filename :
307391
Link To Document :
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