Title :
The mischmetal and Bi94Zn6 effect alloying on SACX 0307
Author :
Branzei, Mihai ; Pencea, Ion ; Plotog, I. ; Miculescu, F. ; Cristea, Ionut ; Thumm, Andreas
Author_Institution :
CEMS, Univ. Politeh. of Bucharest, Bucharest, Romania
Abstract :
According to “4P Soldering Model” (Paste-Pad-Pin-Process) [1], solder paste will be selected from a typically paste solutions determined by solder alloy as basic material, flux and geometry aspects consequences of stencil design. The functions are in direct connection with the solder joint microstructure. The new SACX 0307 solder alloys, inoculated with mischmetal (MM) and Bi94Zn6 near eutectic alloy, proposal for studies take into considerations the criteria and desired attributes for Lead-Free solder alloy. The results of experiments performed are present, by using SEM/EDS technique. These results will be evaluated in order to obtain a new solder paste for improving process control in VPS lines by minimize the cooling rate effect on solder joint structure. Thus, it can be assure the solder joints reliability by reducing defects numbers and rework time.
Keywords :
X-ray chemical analysis; alloying; bismuth alloys; cooling; eutectic alloys; rare earth alloys; reliability; scanning electron microscopy; solders; zinc alloys; 4P soldering model; Bi94Zn6 alloying effect; Bi94Zn6 near eutectic alloy; EDS technique; SACX 0307 solder alloys; SEM; SiYLaCePrNdPmDyAmGdBi94Zn6; VPS lines; cooling rate effect; mischmetal; paste-pad-pin-process model; solder joint microstructure; solder joints reliability; solder paste; stencil design; Bismuth; Grain size; Silicon; Soldering; Tin; Zinc;
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
DOI :
10.1109/ISSE.2013.6648208
