Title :
Experimental and numerical assessment of adhesion in real-life MEMS
Author :
Ardito, R. ; Baldasarre, L. ; Corigliano, A. ; De Masi, B. ; Frangi, A. ; Magagnin, L.
Author_Institution :
Politec. di Milano, Milan, Italy
Abstract :
The goal of this research is to measure the adhesion energy in experimental devices which are as alike as possible to real-life MEMS and to provide a sound basis for numerical methods which could predict the adhesion energy in various situations. In this way, a better knowledge of adhesion properties is obtained, possibly entailing deeper miniaturization and higher optimization of microstructures. The paper describes the innovative experimental measurements which have been carried out and the comparison with numerical outcomes via Finite Element Method (FEM).
Keywords :
adhesion; finite element analysis; micromechanical devices; MEMS; adhesion energy measurement; adhesion energy prediction; finite element method; microstructure optimization; Computational modeling; Deformable models; Displacement measurement; Face; Micromechanical devices;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191767
