Photoimageable details on LTCC ceramic

The researches on fabrication of photoimageable details essential for multilayer electronic circuits design were conducted. Such details as conducting paths and electrical pads were fabricated onto unfired LTCC tapes. The shrinkage of such structures during firing process were investigated as well as some electrical parameters. Moreover, vias indispensable for the multilayer interconnections were performed and filled with the conductive ink using two different techniques.