DocumentCode :
1953583
Title :
Absorption and diffusion of water in printed circuit boards
Author :
Zecha, Heiner ; Fruh, Christiane ; Ratchev, R. ; Biehl, Erik ; Zerna, Thomas
Author_Institution :
Robert Bosch GmbH, Schwieberdingen, Germany
fYear :
2013
fDate :
8-12 May 2013
Firstpage :
121
Lastpage :
126
Abstract :
When exposed to harsh and humid environments, electronic systems can show electrochemical corrosion. One of the possible defects is Conductive Anodic Filament (CAF). This defect needs the presence of humidity. Though the moisture uptake of printed circuit boards has been studied thoroughly, a complete understanding of the diffusion processes and paths in printed circuit boards has not yet been achieved. This work deals with the anisotropy of moisture diffusion in the laminate. According to this purpose samples have been produced and tested. The results show a different absorption behavior according to sample type and base material as well as to storage temperature and humidity. The diffusion constants can be extracted from the measured mass changes of the samples. Since the different sample designs allow diffusion only in specific directions, a determination of the anisotropy is feasible. Furthermore, information on the storage location of the moisture in printed circuit boards can be gained. Therefore, samples have been produced to investigate the absorption behavior of different components of printed circuit boards such as resin and glass weave.
Keywords :
absorption; corrosion; diffusion; laminates; printed circuit design; printed circuit testing; CAF; conductive anodic filament; electrochemical corrosion; electronic system; glass weave; humidity; laminate; moisture diffusion anisotropy; moisture uptake; printed circuit board; resin; storage temperature; water absorption; water diffusion; Absorption; Fabrics; Humidity; Moisture; Printed circuits; Resins;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
ISSN :
2161-2528
Type :
conf
DOI :
10.1109/ISSE.2013.6648227
Filename :
6648227
Link To Document :
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