Multilayer alumina substrates for ECU [automotive electronics]

Author

Sugai, Kouichiro ; Matsumoto, Hiroshi ; Shimojyou, Yoshiaki ; Kishira, Yuji

Author_Institution

Corp. Semicond. Components Div., Kyocera Corp., Kyoto City, Japan

fYear

1998

fDate

27-29 Apr 1998

Firstpage

109

Lastpage

112

Abstract

Alumina multilayer ceramic substrates (MLCS) offer high reliability for use in the automotive field in terms of significant size reduction, thermal durability, high heat dissipation, rigidity, and extended practical application. The work described in this paper summarizes the achievements of design significance of multilayer cofired alumina. The combination of the inherited superior design and processing rules brings forth the realization of miniaturization of about 30% in terms of size (area) compared to the use of conventional glass epoxy substrates. In addition, the thermal conductivity of alumina, 18 W/mK, which is almost 10 times that of glass ceramics (LTCC), and its inherited mechanical/thermal durability enables the substrate to be attached directly to the engine with good heat dissipation. We performed various reliability tests for the substrates for 3000 hours/3000 cycles without any defects. Additional alumina multilayer technology applications for automotive electronics besides electronic control units (ECU) are mentioned in this paper

Keywords

alumina; automotive electronics; ceramic packaging; cooling; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; shear modulus; thermal conductivity; thermal management (packaging); thermal stability; 3000 hr; Al₂O₃; ECU; LTCC; alumina multilayer ceramic substrates; alumina multilayer technology; automotive electronics; direct substrate-engine attachment; electronic control units; glass ceramics; glass epoxy substrates; heat dissipation; mechanical durability; miniaturization; multilayer alumina substrates; multilayer cofired alumina; reliability; reliability tests; rigidity; size reduction; thermal conductivity; thermal durability; Automotive electronics; Automotive engineering; Ceramics; Glass; Heat engines; Nonhomogeneous media; Performance evaluation; Process design; Testing; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International

Conference_Location

Berlin

Print_ISBN

0-7803-4520-7

Type

conf

DOI

10.1109/IEMTE.1998.723068

Filename

723068