Title :
Temperature compensated field bus sensor interface for applications in process engineering
Author :
Suthau, Eike ; Hildebrandt, S. ; Wolter, Klaus-Jurgen
Author_Institution :
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
Abstract :
A robust, high precision sensor interface (SI) for in-situ temperature measurements in process engineering is presented. Wiring and interference are minimized by directly connecting thick film technology based sensing elements (SEs) to the interface PCB. Fully digital calibration, operating temperature compensation and noise canceling are demonstrated. A low-noise supply scheme for a wide range of operating voltages is examined. Parallel operation of up to 120 units on a self-managing CAN field bus is discussed. The protocol for the sensor interface´s user-friendly generic serial ACM USB connection is illustrated.
Keywords :
compensation; controller area networks; field buses; protocols; sensors; temperature control; controller area networks; film technology based sensing elements; fully digital calibration; generic serial ACM USB connection; in-situ temperature measurements; interface PCB; low-noise supply scheme; noise canceling; operating temperature compensation; process engineering; self-managing CAN field bus; temperature compensated field bus sensor interface; Calibration; Noise; Silicon; Temperature distribution; Temperature measurement; Temperature sensors;
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
DOI :
10.1109/ISSE.2013.6648274
