Title :
Numerical and experimental study of Microscale Laser Shock Processing using excimer laser
Author :
Che, Zhigang ; Xiong, Liangcai ; Shi, Tielin ; Tang, Zirong ; Cheng, Huayang ; Yang, Likun
Author_Institution :
State Key Lab. of Digital Manuf. Equip. & Technol., Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
Microscale laser shock processing (LSP) can impart compressive residual stress in micro electromechanical systems (MEMS) components through laser-induced plasma and pressure pulse for improving fatigue performance and wear resistance. The excimer laser was used on muLSP for shorter wavelength than that in previous researches. The determination method of laser spot size at micro-level spatial resolution was firstly presented. The beam sizes of 20~200 microns were used at the first time for muLSP in simulation and experiment. Under these conditions, the characteristic parameters (including plastic deformation and residual stress) were investigated through FEM simulation and laser irradiation experiment, besides the micro-hardness being measured. The experimental results had good agreements with ones of simulation and showed the material performances were remarkably improved after muLSP.
Keywords :
excimer lasers; fatigue; finite element analysis; internal stresses; laser materials processing; microfabrication; microhardness; micromechanical devices; plasma materials processing; plastic deformation; wear resistance; FEM simulation; MEMS components; compressive residual stress; excimer laser; fatigue performance; laser irradiation; laser spot size determination; laser-induced plasma; laser-induced pressure pulse; micro electromechanical systems; microhardness; microlevel spatial resolution; microscale laser shock processing; plastic deformation; wear resistance; Electric shock; Electromechanical systems; Fatigue; Micromechanical devices; Optical pulses; Plasma materials processing; Plasma waves; Pulse compression methods; Residual stresses; Spatial resolution; Excimer laser; Micro-hardness; Microscale LSP; Plastic deformation; Residual stress;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
DOI :
10.1109/NEMS.2009.5068574
