Title :
Mechanical properties and adhesion measurements of films used in advanced packages
Author :
Guzman, Melissa Shell-De ; Hack, Mary ; Neubaue, Gabi
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
"Depth-sensing" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three different techniques can be employed to determine these mechanical properties. The first part of this paper describes each technique. The second part of this paper presents two applications that employ these techniques to measure the properties of various materials used in advanced integrated circuit packages, including polyimide die coat modulus and adhesion, and SnPb solder plate hardness.<>
Keywords :
adhesion; circuit reliability; hardness testing; integrated circuit testing; packaging; polymer films; adhesion measurements; advanced packages; depth-sensing ultra micro-indentation; elastic modulus; hardness; integrated circuit packages; polyimide die coat modulus; solder plate hardness; Adhesives; Bonding forces; Integrated circuit packaging; Mechanical factors; Mechanical variables measurement; Optical films; Plastics; Size measurement; Stress; Testing;
Conference_Titel :
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-1357-7
DOI :
10.1109/RELPHY.1994.307849
