Title :
A new formulation of yield enhancement problems for reconfigurable chips
Author :
Hasan, N. ; Cong, J. ; Liu, C.L.
Author_Institution :
Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Abstract :
The covering problem assigns redundant elements to replace defective elements so that the chip will function properly. A general model that can be used to represent the relationship between redundant elements and defective elements in a uniform way is presented. This model subsumes many of the models discussed in previous approaches. A complete characterization of the complexity of the covering problems in all the subcases of the model, most of which have not been studied before, is given. It is hoped that the formulation will also lead to new ways of designing reconfigurable chips.<>
Keywords :
VLSI; computational complexity; graph theory; integrated circuit technology; redundancy; complexity; covering problem; defective elements; reconfigurable chips; redundant elements; yield enhancement; Computer science; Fabrication; Heuristic algorithms; Production;
Conference_Titel :
Computer-Aided Design, 1988. ICCAD-88. Digest of Technical Papers., IEEE International Conference on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-8186-0869-2
DOI :
10.1109/ICCAD.1988.122562
