Title :
Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules
Author :
Elger, Gordon ; Voigt, Jan ; Opperman, Hermann
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
Abstract :
The AuSn solder process is applied to optoelectronic modules using a high accuracy flip-chip bonder (Karl Suss FC150). The different requirements of the modules are matched by adjusting the metallization layers of the bond pads, the solder deposition and the bonding parameters, i.e. temperature, bond-force and hold-time
Keywords :
flip-chip devices; gold alloys; integrated circuit metallisation; integrated optoelectronics; modules; optical fabrication; optical transmitters; soldering; tin alloys; AuSn; AuSn solder processes; after bonding accuracy; bond pads; bond-force; bonding parameters; flip-chip-bonding; high accuracy flip-chip bonder; hold-time; metallization layers; optoelectronic modules; solder deposition; temperature; Assembly; Bonding; Gold; Intermetallic; Lenses; Mechanical factors; Metallization; Optical devices; Soldering; Temperature;
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-7105-4
DOI :
10.1109/LEOS.2001.968860
