• DocumentCode
    1964203
  • Title

    Smart integrated temperature sensor - mixed-signal circuits and systems in 32-nm and beyond

  • Author

    Li, Y. William ; Lakdawala, Hasnain

  • Author_Institution
    Adv. Design & Intel Lab., Intel Corp., USA
  • fYear
    2011
  • fDate
    19-21 Sept. 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Integrating smart temperature sensors into digital platforms facilitates information to be processed and transmitted, and open up new applications. Furthermore, temperature sensors are crucial components in computing platforms to manage power-efficiency trade-offs reliably under a thermal budget. This paper presents a holistic perspective about smart temperature sensor design from system- to device-level including manufacturing concerns. Through smart sensor design evolutions, we identify some scaling paths and circuit techniques to surmount analog/mixed-signal design challenges in 32-nm and beyond. We close with opportunities to design smarter temperature sensors.
  • Keywords
    intelligent sensors; mixed analogue-digital integrated circuits; temperature sensors; analog-mixed-signal design; digital platform; holistic perspective; mixed-signal circuits; power-efficiency trade-offs; size 32 nm; smart integrated temperature sensor design; thermal budget; Accuracy; Calibration; Intelligent sensors; Temperature; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2011 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4577-0222-8
  • Type

    conf

  • DOI
    10.1109/CICC.2011.6055295
  • Filename
    6055295