DocumentCode
1964203
Title
Smart integrated temperature sensor - mixed-signal circuits and systems in 32-nm and beyond
Author
Li, Y. William ; Lakdawala, Hasnain
Author_Institution
Adv. Design & Intel Lab., Intel Corp., USA
fYear
2011
fDate
19-21 Sept. 2011
Firstpage
1
Lastpage
8
Abstract
Integrating smart temperature sensors into digital platforms facilitates information to be processed and transmitted, and open up new applications. Furthermore, temperature sensors are crucial components in computing platforms to manage power-efficiency trade-offs reliably under a thermal budget. This paper presents a holistic perspective about smart temperature sensor design from system- to device-level including manufacturing concerns. Through smart sensor design evolutions, we identify some scaling paths and circuit techniques to surmount analog/mixed-signal design challenges in 32-nm and beyond. We close with opportunities to design smarter temperature sensors.
Keywords
intelligent sensors; mixed analogue-digital integrated circuits; temperature sensors; analog-mixed-signal design; digital platform; holistic perspective; mixed-signal circuits; power-efficiency trade-offs; size 32 nm; smart integrated temperature sensor design; thermal budget; Accuracy; Calibration; Intelligent sensors; Temperature; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference (CICC), 2011 IEEE
Conference_Location
San Jose, CA
ISSN
0886-5930
Print_ISBN
978-1-4577-0222-8
Type
conf
DOI
10.1109/CICC.2011.6055295
Filename
6055295
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