DocumentCode
1964566
Title
Characterization of SRAM sense amplifier input offset for yield prediction in 28nm CMOS
Author
Abu-Rahma, Mohamed H. ; Chen, Ying ; Sy, Wing ; Ong, Wee Ling ; Ting, Leon Yeow ; Yoon, Sei Seung ; Han, Michael ; Terzioglu, Esin
Author_Institution
Qualcomm Inc., San Diego, CA, USA
fYear
2011
fDate
19-21 Sept. 2011
Firstpage
1
Lastpage
4
Abstract
Random variations play a critical role in determining SRAM yield, by affecting both the bitcell and the read sense amplifiers (SA). In this work, a process control monitor for SRAM SA offset is proposed and implemented in 28nm LP CMOS technology. The monitor provides accurate measurement of SA offset from a large sample size and accounts for all proximity effects that may affect the SA offset. The all-digital design of the monitor makes it adequate for low voltage testing, high speed data collection, and ease of migration to newer technologies. Detailed measurement results are provided for two of the most commonly used sense amplifiers at different supply and temperature conditions. Statistical yield estimation using the measured sense amplifier offset shows good correlation with measured yield for a 512Kb SRAM. The monitor is a critical part of SRAM silicon yield validation, which is becoming of increasing importance with technology scaling, and the significant increase in random variations.
Keywords
CMOS memory circuits; SRAM chips; integrated circuit testing; CMOS; SRAM sense amplifier input offset; SRAM silicon yield validation; all-digital design; high speed data collection; low voltage testing; process control monitor; proximity effects; read sense amplifiers; size 28 nm; statistical yield estimation; word length 512000 bit; yield prediction; Current measurement; Monitoring; Random access memory; Semiconductor device measurement; Silicon; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference (CICC), 2011 IEEE
Conference_Location
San Jose, CA
ISSN
0886-5930
Print_ISBN
978-1-4577-0222-8
Type
conf
DOI
10.1109/CICC.2011.6055315
Filename
6055315
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