• DocumentCode
    1965375
  • Title

    The new millennium: wireless technologies for a truly mobile society

  • Author

    Weinberger, G.

  • Author_Institution
    Infineon Technol., Munich, Germany
  • fYear
    2000
  • fDate
    9-9 Feb. 2000
  • Firstpage
    20
  • Lastpage
    24
  • Abstract
    Universal access to a wide range of telecommunication services, from speech over multimedia to navigation and mobile computing, must be provided for the mobile society of the next millennium. The backbone of this scenario is a worldwide high-bandwidth wireless system. The wireless terminals of the next millennium, comprising all conceivable services in small size with long operating time require significant improvements in all underlying technologies as well as new architectures and new development strategies and design tools. The computing power needed from several tens of millions transistors at high clock rates requires new approaches simultaneously to allow maximum performance and minimum leakage current. Revived conversion principles like direct downconversion start to be seen in volume production. These concepts put most selection into baseband, avoiding a SAW filter and drastically reducing the number of RF blocks. Power amplifiers still use expensive GaAs HBTs. New concepts will improve power-added efficiency and give GaAs a push. For low-transmit-power applications, silicon PAs with higher performance and lower cost soon will be feasible. MEMS technologies will allow integration of mechanical antenna switches as well as other discrete RF circuitry. The remaining discretes will be integrated by advanced packaging technologies such as subsystem assembly, multi-chip or system module packages. With present growth rates, the sales of wireless terminals will exceed those of computers and internet nodes. These terminals will drive CMOS technology.
  • Keywords
    CMOS integrated circuits; micromechanical devices; mobile communication; packaging; telecommunication services; CMOS technology; MCM; MEMS technologies; advanced packaging technologies; development strategies; direct downconversion; high-bandwidth wireless system; leakage current; low-transmit-power applications; mobile society; operating time; power-added efficiency; subsystem assembly; system module packages; telecommunication services; volume production; wireless technologies; CMOS technology; Gallium arsenide; Integrated circuit technology; Mobile computing; Multimedia computing; Navigation; Packaging; Radio frequency; Speech; Telecommunication services;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5853-8
  • Type

    conf

  • DOI
    10.1109/ISSCC.2000.839677
  • Filename
    839677