Title :
Deeply-Scaled E/D-Mode GaN-HEMTs for Sub-mm-Wave Amplifiers and Mixed-Signal Applications
Author :
Shinohara, K. ; Regan, D. ; Corrion, A. ; Brown, Dean ; Alvarado-Rodoriguez, I. ; Cunningham, Michael ; Butler, Charles ; Schmitz, A. ; Kim, Sungho ; Holden, Bobby ; Chang, David ; Lee, Victor ; Asbeck, P.M.
Abstract :
In this paper, we report state-of-the-art high-frequency performance of GaN-based HEMTs achieved through innovative device scaling technologies such as vertically-scaled AlN/GaN/AlGaN double-heterojunction (DH) HEMT epitaxial structure, low-resistance n+-GaN ohmic contacts regrown by MBE, and manufacturable 20-nm self-aligned sidewall gate process. Engineering top barrier layer structure enabled both enhancement- and depletion-mode (E/D) device operations with record cutoff frequencies while maintaining Johnson figure of merit (JFoM) breakdown performance. Furthermore, E/D-mode devices were monolithically integrated using a full epitaxial regrowth technique with a successful demonstration of DCFL ring oscillator circuits. Deeply-scaled E/D-mode GaN-HEMTs with an unprecedented combination of high-frequency and high-breakdown characteristics offer practical advantages in circuit applications such as sub-millimeter-wave power amplifiers, ultra-linear mixers, and increased output power digital-to-analog converters.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; molecular beam epitaxial growth; ohmic contacts; semiconductor device breakdown; semiconductor growth; semiconductor heterojunctions; submillimetre wave amplifiers; submillimetre wave oscillators; wide band gap semiconductors; AlN-GaN-AlGaN; DCFL ring oscillator circuits; JFoM breakdown performance; Johnson figure of merit; MBE; deeply-scaled E-D-mode HEMT; depletion-mode device operations; device scaling technology; double-heterojunction HEMT epitaxial structure; engineering top barrier layer structure; enhancement-mode device operations; full epitaxial regrowth technique; high-breakdown characteristics; high-frequency characteristics; low-resistance ohmic contacts; mixed-signal applications; power digital-to-analog converters; self-aligned sidewall gate process; size 20 nm; submillimetre-wave amplifiers; ultralinear mixers; vertically-scaled DH HEMT epitaxial structure; Cutoff frequency; DH-HEMTs; Epitaxial growth; Gallium nitride; Logic gates; MODFETs;
Conference_Titel :
Compound Semiconductor Integrated Circuit Symposium (CSICS), 2012 IEEE
Conference_Location :
La Jolla, CA
Print_ISBN :
978-1-4673-0928-8
DOI :
10.1109/CSICS.2012.6340075