• DocumentCode
    1965896
  • Title

    A 780 MHz PowerPC/sup TM/ microprocessor with integrated L2 cache

  • Author

    Bearden, D.R. ; Caffo, D.G. ; Anderson, P. ; Rossbach, P. ; Iyengar, N. ; Petersen, T.A. ; Jen-Tien Yen

  • Author_Institution
    Motorola Somerset Design Center, Austin, TX, USA
  • fYear
    2000
  • fDate
    9-9 Feb. 2000
  • Firstpage
    90
  • Lastpage
    91
  • Abstract
    This microprocessor implements the PowerPC/sup TM/ architecture and incorporates AltiVec/sup TM/ technology. Features include processor pipeline depth changes and memory subsystem enhancements for total system performance improvements through frequency scaling and sustained IPC. The processor is in 0.18 /spl mu/m 1.5V twin-well CMOS with local interconnect and 6 layers of copper interconnect. Using semi-custom flow, the chip includes a mixture of custom circuit macros for high-performance and high-density, and off-the-shelf datapath elements with standard cell control logic to enhance designer productivity. Circuits are static or 2-phase domino precharged, both footed and unfooted. The 2-phase clocking is augmented by delayed-reset clocks for unfooted circuits and by local delays in array macros. Each clock rising edge or self-timed delay has programmable adjustments for debug. Caches include fuse programmable row and column redundancy.
  • Keywords
    CMOS digital integrated circuits; cache storage; microprocessor chips; pipeline processing; redundancy; timing; 0.18 micron; 1.5 V; 2-phase domino precharged; 780 MHz; AltiVec technology; Cu; Cu interconnect; PowerPC architecture; PowerPC microprocessor; delayed-reset clocks; fuse programmable column redundancy; fuse programmable row redundancy; integrated L2 cache; memory subsystem enhancements; processor pipeline depth changes; static circuits; twin-well CMOS process; two-phase clocking; CMOS process; CMOS technology; Clocks; Delay; Frequency; Integrated circuit interconnections; Microprocessors; Pipelines; Power system interconnection; System performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-5853-8
  • Type

    conf

  • DOI
    10.1109/ISSCC.2000.839704
  • Filename
    839704