DocumentCode
1966179
Title
Band-gap circuit design challenges in high-performance 32-nm technology
Author
Buller, J.F. ; Fletcher, J. ; Meyers, S. ; Robinson, M. ; Tamayo, F. ; Prakash, A. ; Cabler, D.
fYear
2011
fDate
19-21 Sept. 2011
Firstpage
1
Lastpage
4
Abstract
32-nm complementary metal oxide semiconductor (CMOS) silicon-on-insulator (SOI) with metal gate high-k (MGHK) offers high performance and low power for microprocessors. However, these advanced technologies come with challenges for analog design. Many of the stressor performance elements can adversely impact analog circuit behavior. For example, band-gap circuits, used ubiquitously in voltage references, are one such challenging component. We investigated both design and process methods that resulted in robust band-gap voltage and temperature response characteristics without impacting performance elements for microprocessor frequency.
Keywords
CMOS digital integrated circuits; microprocessor chips; network synthesis; silicon-on-insulator; CMOS; SOI; analog circuit behavior; band-gap circuit design; band-gap voltage; complementary metal oxide semiconductor; microprocessors; silicon-on-insulator; size 32 nm; stressor performance elements; CMOS integrated circuits; DSL; Equations; P-n junctions; Performance evaluation; Photonic band gap; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference (CICC), 2011 IEEE
Conference_Location
San Jose, CA
ISSN
0886-5930
Print_ISBN
978-1-4577-0222-8
Type
conf
DOI
10.1109/CICC.2011.6055396
Filename
6055396
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