• DocumentCode
    1966179
  • Title

    Band-gap circuit design challenges in high-performance 32-nm technology

  • Author

    Buller, J.F. ; Fletcher, J. ; Meyers, S. ; Robinson, M. ; Tamayo, F. ; Prakash, A. ; Cabler, D.

  • fYear
    2011
  • fDate
    19-21 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    32-nm complementary metal oxide semiconductor (CMOS) silicon-on-insulator (SOI) with metal gate high-k (MGHK) offers high performance and low power for microprocessors. However, these advanced technologies come with challenges for analog design. Many of the stressor performance elements can adversely impact analog circuit behavior. For example, band-gap circuits, used ubiquitously in voltage references, are one such challenging component. We investigated both design and process methods that resulted in robust band-gap voltage and temperature response characteristics without impacting performance elements for microprocessor frequency.
  • Keywords
    CMOS digital integrated circuits; microprocessor chips; network synthesis; silicon-on-insulator; CMOS; SOI; analog circuit behavior; band-gap circuit design; band-gap voltage; complementary metal oxide semiconductor; microprocessors; silicon-on-insulator; size 32 nm; stressor performance elements; CMOS integrated circuits; DSL; Equations; P-n junctions; Performance evaluation; Photonic band gap; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference (CICC), 2011 IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    0886-5930
  • Print_ISBN
    978-1-4577-0222-8
  • Type

    conf

  • DOI
    10.1109/CICC.2011.6055396
  • Filename
    6055396