DocumentCode
1966804
Title
53 GHz static frequency divider in a Si/SiGe bipolar technology
Author
Wurzer, M. ; Meister, T.F. ; Knapp, H. ; Aufinger, K. ; Schreiter, R. ; Boguth, S. ; Treitinger, L.
Author_Institution
Corp. Res., Infineon Technol. AG, Munich, Germany
fYear
2000
fDate
9-9 Feb. 2000
Firstpage
206
Lastpage
207
Abstract
High-speed static frequency divider ICs are critical functional blocks in a variety of applications, ranging from RF instrumentation to broadband optical fiber communication systems. For these systems maximum speed is mandatory, while power consumption is not a limiting factor. To date, impressive results have been achieved with realizations in different technologies: 66 GHz with InAlAs/InGaAs transferred-substrate HBTs and 50 GHz with SiGe bipolar HBTs. These measurements have been been performed on-wafer. The best published value for a mounted static frequency divider, fabricated in an InAlAs/InGaAs/InP HEMT technology, is 45.2 GHz. On-wafer measurements of frequency dividers are considered as a benchmark for evaluating the speed performance of IC technologies, while measurement results on mounted chips are interesting from the application point of view. Both types of results are presented here.
Keywords
Ge-Si alloys; bipolar integrated circuits; elemental semiconductors; frequency dividers; high-speed integrated circuits; semiconductor materials; silicon; 53 GHz; HBT; Si-SiGe; Si/SiGe bipolar technology; high-speed static frequency divider IC; Frequency conversion; Frequency measurement; Germanium silicon alloys; Indium compounds; Indium gallium arsenide; Optical frequency conversion; Radio frequency; Semiconductor device measurement; Silicon germanium; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
0-7803-5853-8
Type
conf
DOI
10.1109/ISSCC.2000.839751
Filename
839751
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