DocumentCode :
1968439
Title :
Electrical Performance of Electronic Packaging [frontmatter]
fYear :
1997
fDate :
27-29 Oct. 1997
Abstract :
Conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original conference proceedings.
Keywords :
packaging; accelerated modeling; characterization techniques; coupling; crosstalk simulation; electrical performance; electronic packaging; microwave packaging; model verification; on-chip interconnect parameter extraction; on-chip noise analysis; power distribution design; radiated emission; simulation; simultaneous switching noise modeling; system design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-8649-3
Type :
conf
DOI :
10.1109/EPEP.1997.634022
Filename :
634022
Link To Document :
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