• DocumentCode
    1971105
  • Title

    Non-Contact PIM Measurement Method for Electrical Connection Inspection

  • Author

    Kuga, Nobuhiro ; Ohnishi, Ken-ichi

  • Author_Institution
    Fac. of Eng., Yokohama Nat. Univ., Yokohama
  • fYear
    2007
  • fDate
    11-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A non-contact inspection method using electromagnetic intermodulation is proposed for electrical connections. It uses heavy intermodulation, which occurs at the connection with high current density. In the proposed method, a small probe at the tip of semi-rigid coaxial line excites the DUT and detects the intermodulation signal via the near field, which is effective to achieve high spatial resolution. In this paper, a small monopole and a small loop are used as the probes and their capability are examined through the experiments. The evaluation result of a packaged substrate is also shown as an application. To evaluate the capability of the proposed technique, an electrical contact is used as a defected connection. As a sample of other kinds of noise sources, the sample containing a ferromagnetic material in part is also evaluated. The results show that the loop-probe wrapping around the DUT is effective to detect the PIM source even in a continuous material, and the monopole-probe is effective to evaluate electrical-connection failures.
  • Keywords
    electrical contacts; inspection; intermodulation; electrical connection inspection; electrical connections; electrical-connection failures evaluation; electromagnetic intermodulation; monopole-probe; noncontact inspection method; noncontact passive intermodulation measurement method; Coaxial components; Contacts; Current density; Electric variables measurement; Electromagnetic measurements; Inspection; Packaging; Probes; Signal detection; Spatial resolution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2007. APMC 2007. Asia-Pacific
  • Conference_Location
    Bangkok
  • Print_ISBN
    978-1-4244-0748-4
  • Electronic_ISBN
    978-1-4244-0749-1
  • Type

    conf

  • DOI
    10.1109/APMC.2007.4554558
  • Filename
    4554558