DocumentCode
1972005
Title
Significance of electromagnetic coupling through vias in electronics packaging
Author
Zhao, Jin ; Fang, Jiayuan
Author_Institution
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1997
fDate
27-29 Oct. 1997
Firstpage
135
Lastpage
138
Abstract
The investigation on the relative significance of electromagnetic coupling between vias and parallel traces is presented in this paper. This study shows that the coupling between vias can often be stronger than the coupling between traces and is therefore not negligible in signal integrity analysis of high-speed electronic packages.
Keywords
packaging; electromagnetic coupling; high-speed electronic package; parallel trace; signal integrity analysis; via; Delay; Dielectric constant; Electromagnetic coupling; Electronics packaging; High-speed electronics; Impedance; Signal analysis; Strips; Transmission line matrix methods; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1997., IEEE 6th Topical Meeting on
Conference_Location
Austin, TX
Print_ISBN
0-7803-8649-3
Type
conf
DOI
10.1109/EPEP.1997.634056
Filename
634056
Link To Document