Junction-to-Case Thermal Modeling and the Significance of the Junction Power Profile on Thermal Response

Author

McShane, Erik A. ; Shenai, Krishna

Author_Institution

University of Illinois, Chicago, USA

fYear

2001

fDate

11-13 September 2001

Firstpage

499

Lastpage

502

Keywords

Circuit faults; Equivalent circuits; Impedance; MOSFETs; Packaging; Power dissipation; SPICE; Steady-state; Temperature; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 2001. Proceeding of the 31st European

Print_ISBN

2-914601-01-8

Type

DOI

10.1109/ESSDERC.2001.195310

Filename

1506692

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