DocumentCode
1973192
Title
Microvia Fill Ratio Control
Author
Tenno, Robert ; Pohjoranta, Antti
Author_Institution
Helsinki Univ. of Technol., Espoo
fYear
2007
fDate
4-7 June 2007
Firstpage
153
Lastpage
156
Abstract
A control law for microvia fill process optimization is proposed in this paper. The law enables linear growth of either microvia fill ratio by applying nonlinear control of cell voltage or plating current density, implemented as a set point trajectory for a potentiostat or galvanostat, respectively. Linear deposit growth enables accurate prediction of plating duration and end time. The control system is simulated and compared with results of via fill tests.
Keywords
electroplating; integrated circuit interconnections; printed circuits; semiconductor process modelling; cell voltage; linear deposit growth; microvia fill ratio control; nonlinear control; plating current density; plating duration; process optimization; Additives; Cathodes; Chemical processes; Chemistry; Circuit testing; Copper; Current density; Electric variables control; Microscopy; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2007. ISIE 2007. IEEE International Symposium on
Conference_Location
Vigo
Print_ISBN
978-1-4244-0754-5
Electronic_ISBN
978-1-4244-0755-2
Type
conf
DOI
10.1109/ISIE.2007.4374590
Filename
4374590
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