Optimization of Packaging for PIN Photodiode Modules for 100Gbit/s Ethernet Applications

Author

Jiang, C. ; Johansen, T.K. ; Krozer, V. ; Mekonnen, G.G. ; Bach, H.-G.

Author_Institution

ElectroScience-Oersted, Tech. Univ. of Denmark, Lyngby

fYear

2007

fDate

11-14 Dec. 2007

Firstpage

1

Lastpage

4

Abstract

In this paper the packaging of optical components is investigated employing a conductor backed coplanar waveguide (CBCPW). The study is performed using 3D electromagnetic (EM) simulations in a broadband range up to 110 GHz. Higher-order resonances are observed in both measurement and simulation results. Based on the verified EM simulation setup, the origin of resonances is identified and remedies are suggested in the paper. Several optimization schemes for achieving good transmission characteristics for the planar structure as well as for the coax-CPW transition are proposed such as properly coating side metallization on the CPW, substrate spacing to the metal housing, and developing metal posts in the substrate of the CPW.

Keywords

coaxial waveguides; coplanar waveguides; local area networks; optimisation; p-i-n photodiodes; 3D electromagnetic simulations; Ethernet; PIN photodiode; bit rate 100 Gbit/s; coax-CPW transition; conductor backed coplanar waveguide; metal housing; optical components; optimization schemes; substrate spacing; Conductors; Coplanar waveguides; Electromagnetic waveguides; Ethernet networks; Optical devices; Optical waveguide components; Optical waveguides; PIN photodiodes; Packaging; Resonance; Coplanar waveguides; electromagnetic simulation; higher order resonances; waveguide transitions;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2007. APMC 2007. Asia-Pacific

Conference_Location

Bangkok

Print_ISBN

978-1-4244-0748-4

Electronic_ISBN

978-1-4244-0749-1

Type

conf

DOI

10.1109/APMC.2007.4554950

Filename

4554950